Diamond Wire Cutting Wafer

310 μm feed rate.

Diamond wire cutting wafer.

In addition to the supply of diamond wire we can also provide high quality diamond beads with customized sizes or in the following average diameters. Slicingtech serves the needs of companies who require high precision high volume wafer slicing. The diamond wire slicing process we employ provides our customers less kerf loss with outstanding finishes to micron level tolerances. This is done in baths with hot water or diluted acid.

The diamond wire cutting head is used whenever there is a requirement to produce a cut with minimum surface and sub surface damage. 20 μm 20 μm results subject to change based on process material and cutting orientation parameters cropless ingot process diamond wire. 200 μm 250 μm wire speed. 12 m sec 12 m sec wire tension.

We offer contract slicing using diamond wire. Along with a wide range of meyer burger slicing systems we now feature the world renowned state of the art meyer burger dw 288 and meyer burger dw 265 diamond wire slicing systems for hard and brittle. Contract diamond wire slicing. Abrasive slurry saw wire with abrasive slurry diamond wire without abrasive slurry silicon.

Wire saw contract cutting and wafer slicing slicingtech serves the needs of companies who require high precision high volume wafer slicing. 15 μm 15 μm bow. It is important that the adhesive does not contaminate the debonding bath and the silicon but adheres to the carrier. You can request information concerning quantity details and prices by contacting us or filling in the form.

The new environmentally friendly diamond wire technology for wire saws doubles the cutting speed of saws. The working principle is that under a certain tension the wire saw grinds and cuts the object removes the debris and heat with cooling water and finally divides. Along with a wide range of meyer burger wafer slicing systems we now feature the world renowned state of the art meyer burger dw 288 diamond wire slicing systems for hard and brittle materials. Our lead times are short and we can accommodate requirements from r d to production quantities.

32 n 35 n cut time 180 minutes 150 minutes tv5. Diamond wire saw is an environmentalhigh efficient safe cutting tool which is a specially designed for cutting and separating crystal material magnetic material or sapphire wafer. Wafer production places high demands on the technology used while the market demands maximum efficiency from manufacturers. Siemens offers optimized automation concepts for high performance ingot cutting machines.